Monolithic Micro-Positioning Stage in Piezo Thick Film Technology
B. Bramlage, D. Ernst, S. Gebhardt
Fraunhofer IKTS, Dresden, Germany
Piezoceramic thick film technology introduced a novel and efficient method for the fabrication of active bending structures, especially for complex actuator layouts. Here, we present a monolithic micro-positioning stage based on piezoceramic thick film technology. It conducts a planar lift of a platform or optical component. The four bending actuators are comprised of both d33- and d31-mode elements, performing an s-bend that minimizes torque induced into the platform. FEM simulations aid in the design process of the actuator layout. They are fabricated by screen printing on an Al2O3 substrate with a final thickness of 115 μm in the piezoceramic layer and a structured electrode allows for both in-plane and through-thickness aligned fields in the corresponding elements. Operated at 1.66 kV/mm in both elements, a planar lift exceeding 130 μm is demonstrated. With a final device thickness of less than 500 μm it provides the actuator component in the development of a lowprofile optical system employing microlens arrays.
ACTUATOR 2014 Manuscript C3.2
Publication date: 30/11/-0001
Manuscript C3.2 published in Conference Proceedings ACTUATOR 2014
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